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APX9132A
Hall Effect Micro Switch IC
Features
* * * * *
Micro Power Operation for Battery Applications Chopper Stabilized Amplifier Independent of North or South Pole Magnet, Easy for Manufacture Small Size Package Lead Free and Green Devices Available (RoHS Compliant)
General Description
The APX9132A, integrated circuit, is an ultra-sensitive, pole independent Hall-effect switch with a latched digital output. A 1.6 volt to 3.5 volt operation and an unique clocking scheme reduce the average operating power requirements, either a north or a south pole of sufficient flux will turn the output on; in the absence of a magnetic field, the output is off. The polarity independence and minimal power requirement allow this device to be easily replaced reed switch for superior for signal conditioning. Advanced CMOS processing is used to take advantage of low-voltage and low-power requirements, SOT-23 package provides an optimized package for most applications.
Applications
* * * *
Micro Switch Handheld Wireless Application Wake Up Switch Clamp Shell Type Application Switch Magnet Switch in Low Duty Cycle Applications
Pin Configuration
GND
APX9132A
VDD
VOUT
SOT-23-3
Ordering and Marking Information
APX9132A Assembly Material Handling Code Temperature Range Package Code Package Code A : SOT-23-3 AT : TSOT-23 Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device X - Date Code
APX9132A A/AT:
X32X
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Mar., 2009 1 www.anpec.com.tw
APX9132A
Absolute Maximum Ratings
Symbol VDD VOUT IOUT TJ TSTG Supply Voltage Output Voltage Output Current Junction Temperature Range Storage Temperature Range Parameter
TA = 25C unless otherwise noted
Rating 5 5 1 150 -65 to +150 Unit V V mA C
Thermal Characteristics
Symbol JA Power Dissipation, TA=25oC PD SOT-23-3 TSOT-23-3 0.385 0.364 W Parameter Junction-to-Ambient Resistance in Free Air (Note 1) SOT-23-3 TSOT-23-3 260 275
Typical Value
Unit C /W
Note 1: JA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Electrical Characteristics
Symbol VDD Characteristic Supply Voltage Range
TA = 25C, VDD=3V unless otherwise noted
APX9132A Test Conditions Min. Operating Average 1.6 VDD -0.4 Typ. 5 1.2 2 20 180 60 0.3 11 Max. 3.5 10 2 8 1.0 40 V A mA A A V mV s ms % kHz Unit
IDD
Supply Current
Awake Sleep
IOFF VOH VOL tawake tperiod d.c. fc
Output Leakage Current Output High Voltage Output Low Voltage Wake up Time Period Duty Cycle Chopping Frequency
VOUT=3.5V, BRPNCopyright (c) ANPEC Electronics Corp. Rev. A.1 - Mar., 2009
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APX9132A
Magnetic Characteristics
TA = 25C, VDD=1.8V unless otherwise noted
APX9132A Symbol BOPS Operate Points BOPN BRPS Release Points BRPN Bhys Hysteresis -20 10 -10 G G -45 10 -30 20 G G Characteristic Test Conditions Min. Typ. 30 Max. 45 G Unit
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APX9132A
Typical Operating Characteristics
Switching Points vs. Ambient Temperature
BOPS
Switching Points(G)
400 300 Switching Points(G) 200 100 0 -100 -200 -300 -400 -40 -20
500 400 300 200 100 0 -100 -200
Switching Points vs. VDD Supply Voltage
BOPS
BRPS
BRPS
BRPN
BRPN
BOPN
-300 -400
BOPN 1 1.5 2 2.5 3 3.5 4 4.5 5
0 Ambient
20
40
60
80
100
Temperature(oC)
VDD Supply Voltage(V)
10 9 Average Supply Current(A) 8 7 6 5 4 3 2 1 0 -40
Average Supply Current vs. Ambient Temperature
VDD=3.3V
16 Average Supply Current(A) 14 12 10 8 6 4 2
Average Supply Current vs. VDD Supply Voltage
TA = 25oC
-20
0
20
40
60
80 100
0 1.5
2
2.5
3
3.5
4
4.5
5
Ambient Temperature( oC)
VDD Supply Voltage(V)
1 0.9
VDD-VOUT Voltage vs. Output Source Current
0.6 0.5
Output Low Voltage vs. Output Sink Current
Output Low Vlotage(V)
0.8 VDD-VOUT Voltage(V) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Output Source Current(mA) VDD=1.8V VDD=5V VDD=3V
VDD=5V 0.4 VDD=3V 0.3 0.2 0.1 0 VDD=1.8V
0
1
2
3
4
5
6
7
8
9 10
Output Sink Current(mA)
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APX9132A
Operating Waveforms
Output Switch Waveform Output Switch Waveform
Output Voltage (0.5V/div)
VOUT (0.5V/div)
Output Voltage (0.5V/div)
VDD=3V CL=12pF
VDD=3V CL=12pF
VOUT (0.5V/div)
Time (50s/div)
Time (50s/div)
Pin Description
PIN FUNCTION NO 1 2 3 NAME VDD VOUT GND Power Input. When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than BOPN), the output turns on (output is low). When the magnetic field is below the release point BRPS (or above BRPN), the output turns off (output is high). Ground Connection.
Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Mar., 2009
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APX9132A
Block Diagram
VDD
Awake & Sleep Timing Logic
Hall Plane
Dynamic Offset Cancellation
Latch Circuit
VOUT
Chopper Amplifier
Hysteresis Control
GND
Typical Application Circuit
VOUT APX9132A
VDD
+ 1.6V-3.5V 0.1F -
GND
SOT-23-3 (Top View)
Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Mar., 2009
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APX9132A
Function Description
Operation The output of APX9132A switches low (turn-on) when in presence of strong flux density facing the marked side of package exceeds the operate point BOPS (or is less than BOPN). After turn-on, the output is capable of sinking up to 1mA and the output voltage is low (turn-on). In absence of flux density is below the release point BRPS (or increases above BRPN), the APX9132A output switches high (turns off). After turn-off, the output is capable of sourcing up to 1mA and the output voltage is high (turn-off). The difference in the magnetic operated and released point is the hysteresis (Bhys) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical bouncing vibration and electrical noise.
OUTPUT OFF 5V MAX OUTPUT VOLTAGE BOPN BOPS
BRPN 0 -B 0
BRPS
OUTPUT ON +B
MAGNETIC FLUX
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APX9132A
Application Information
It is strongly recommended that an external bypass capacitor can be connected (is close to the Hall sensor) between the supply and the ground of the device to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies. Pole-independent The pole-independent sensing technique allows for operation with either a north or a south pole magnet orientation, enhancing the manufacturability of the device. The state-of-the-art technology provides the same output polarity for either pole in presence. Awake & Sleep Internal awake & sleep timing block circuit activates the sensor for 180 s and deactivates it for the remainder of the period (60 ms). A short "awake" time allows for stabilization prior to the sensor sampling and data latching on the falling edge of the timing pulse. While in sleep cycle, the output is latched in its previous state. Chopper Stabilized Technique The chopper stabilized technique cancels the mismatching of the hall element, the amplifier offset voltage and temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique produces devices has an extremely stable Hall output voltage, therefore, the magnetic switch points are stable.
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APX9132A
Package Information
SOT-23-3
D e
SEE VIEW A
E1
E
b e1
c
0.25
VIEW A SOT-23-3 INCHES MIN. MAX. 0.057 0.000 0.035 0.012 0.003 0.106 0.102 0.055 0.037 BSC 0.075 BSC 0.60 8 0.012 0 0.024 8 0.006 0.051 0.020 0.009 0.122 0.118 0.071 MAX. 1.45 0.15 1.30 0.50 0.22 3.10 3.00 1.80
A2
A
A1
S Y M B O L A A1 A2 b c D E E1 e e1 L 0
MILLIMETERS MIN.
0.00 0.90 0.30 0.08 2.70 2.60 1.40 0.95 BSC 1.90 BSC 0.30 0
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Mar., 2009
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0
L
GAUGE PLANE SEATING PLANE
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APX9132A
Package Information
TSOT-23-3
D e
SEE VIEW A
E1 b e1
E
c
A2
A
0.25 GAUGE PLANE SEATING PLANE L VIEW A TSOT-23-3 INCHES MIN. 0.030 0.001 0.028 0.012 0.003 0.106 0.102 0.055 0.037 BSC 0.075 BSC 0.60 8 0.012 0 0.024 8 MAX. 0.031 0.002 0.030 0.020 0.008 0.122 0.118 0.071 MAX. 0.80 0.05 0.75 0.50 0.20 3.10 3.00 1.80
S Y M B O L A A1 A2 b c D E E1 e e1 L 0
MILLIMETERS MIN. 0.75 0.03 0.70 0.30 0.08 2.70 2.60 1.40 0.95 BSC 1.90BSC 0.30 0
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Mar., 2009
A1
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APX9132A
Carrier Tape & Reel Dimensions
OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B
d
Application
A 178.0O .00 2
H 50 MIN. P1 4.0O .10 0 H 50 MIN. P1 4.0O .10 0
H A
T1
T1 8.4+2.00 -0.00 P2 2.0O .05 0 T1 8.4+2.00 -0.00 P2 2.0O .10 0
C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00
d 1.5 MIN. D1 1.0 MIN. d 1.5 MIN. D1 1.0 MIN.
D 20.2 MIN. T 0.6+0.00 -0.40 D 20.2 MIN. T 0.6+0.00 -0.40
W 8.0O .30 0 A0 3.20O .20 0 W 8.0O .30 0 A0 3.20O .20 0
W
E1 1.75O .10 0 B0 3.10O .20 0 E1 1.75O .10 0 B0 3.10O .20 0
F 3.5O .05 0 K0 1.50O .20 0 F 3.5O .05 0 K0 1.50O .20 0
SOT-23-3
P0 4.0O .10 0
Application
A 178.0O .00 2
TSOT-23-3
P0 4.0O .10 0
(mm)
Devices Per Unit
Package Type SOT-23-3 TSOT-23-3 Unit Tape & Reel Tape & Reel Quantity 3000 3000
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APX9132A
Taping Direction Information
(T)SOT-23-3
USER DIRECTION OF FEED
Classification Profile
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APX9132A
Classification Reflow Profiles
Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak (Tp)* package body Temperature Sn-Pb Eutectic Assembly 100 C 150 C 60-120 seconds 3 C/second max. 183 C 60-150 seconds See Classification Temp in table 1 20** seconds 6 C/second max. 6 minutes max. Pb-Free Assembly 150 C 200 C 60-120 seconds 3C/second max. 217 C 60-150 seconds See Classification Temp in table 2 30** seconds 6 C/second max. 8 minutes max.
Time (tP)** within 5C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process - Classification Temperatures (Tc) Package Thickness <2.5 mm 2.5 mm
3
Volume mm <350 235 C 220 C
3
Volume mm 350 220 C 220 C
3
3
Table 2. Pb-free Process - Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm - 2.5 mm 2.5 mm Volume mm <350 260 C 260 C 250 C Volume mm 350-2000 260 C 250 C 245 C Volume mm >2000 260 C 245 C 245 C
3
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TCT ESD Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD 78 Description 5 Sec, 245C 1000 Hrs, Bias @ 125C 168 Hrs, 100%RH, 2atm, 121C 500 Cycles, -65C~150C VHBMU2KV, VMMU200V 10ms, 1trU 100mA
Copyright (c) ANPEC Electronics Corp. Rev. A.1 - Mar., 2009
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APX9132A
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838
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